skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: The Role of Joule Heating and Defect Chemistry in Memristor Modeling.

Abstract

Abstract not provided.

Authors:
; ; ;
Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE National Nuclear Security Administration (NNSA)
OSTI Identifier:
1241114
Report Number(s):
SAND2015-1525C
567350
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Conference
Resource Relation:
Conference: Proposed for presentation at the American Physical Society - March 2015 Meeting held March 4 - February 4, 2015 in San Antonio , TX.
Country of Publication:
United States
Language:
English

Citation Formats

Tierney, Brian David, Hjalmarson, Harold Paul, McLain, Michael Lee, and Mamaluy, Denis. The Role of Joule Heating and Defect Chemistry in Memristor Modeling.. United States: N. p., 2015. Web.
Tierney, Brian David, Hjalmarson, Harold Paul, McLain, Michael Lee, & Mamaluy, Denis. The Role of Joule Heating and Defect Chemistry in Memristor Modeling.. United States.
Tierney, Brian David, Hjalmarson, Harold Paul, McLain, Michael Lee, and Mamaluy, Denis. 2015. "The Role of Joule Heating and Defect Chemistry in Memristor Modeling.". United States. https://www.osti.gov/servlets/purl/1241114.
@article{osti_1241114,
title = {The Role of Joule Heating and Defect Chemistry in Memristor Modeling.},
author = {Tierney, Brian David and Hjalmarson, Harold Paul and McLain, Michael Lee and Mamaluy, Denis},
abstractNote = {Abstract not provided.},
doi = {},
url = {https://www.osti.gov/biblio/1241114}, journal = {},
number = ,
volume = ,
place = {United States},
year = {Sun Mar 01 00:00:00 EST 2015},
month = {Sun Mar 01 00:00:00 EST 2015}
}

Conference:
Other availability
Please see Document Availability for additional information on obtaining the full-text document. Library patrons may search WorldCat to identify libraries that hold this conference proceeding.

Save / Share: