Methods for fabricating thin film III-V compound solar cell
The present invention utilizes epitaxial lift-off in which a sacrificial layer is included in the epitaxial growth between the substrate and a thin film III-V compound solar cell. To provide support for the thin film III-V compound solar cell in absence of the substrate, a backing layer is applied to a surface of the thin film III-V compound solar cell before it is separated from the substrate. To separate the thin film III-V compound solar cell from the substrate, the sacrificial layer is removed as part of the epitaxial lift-off. Once the substrate is separated from the thin film III-V compound solar cell, the substrate may then be reused in the formation of another thin film III-V compound solar cell.
- Research Organization:
- MicroLink Devices, Inc., Niles, IL (United States)
- Sponsoring Organization:
- USDOE
- Assignee:
- MicroLink Devices, Inc. (Niles, IL)
- Patent Number(s):
- 7,994,419
- Application Number:
- 12/167,583
- OSTI ID:
- 1176431
- Resource Relation:
- Patent File Date: 2008 Jul 03
- Country of Publication:
- United States
- Language:
- English
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