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Title: Methods for fabricating thin film III-V compound solar cell

Patent ·
OSTI ID:1176431

The present invention utilizes epitaxial lift-off in which a sacrificial layer is included in the epitaxial growth between the substrate and a thin film III-V compound solar cell. To provide support for the thin film III-V compound solar cell in absence of the substrate, a backing layer is applied to a surface of the thin film III-V compound solar cell before it is separated from the substrate. To separate the thin film III-V compound solar cell from the substrate, the sacrificial layer is removed as part of the epitaxial lift-off. Once the substrate is separated from the thin film III-V compound solar cell, the substrate may then be reused in the formation of another thin film III-V compound solar cell.

Research Organization:
MicroLink Devices, Inc., Niles, IL (United States)
Sponsoring Organization:
USDOE
Assignee:
MicroLink Devices, Inc. (Niles, IL)
Patent Number(s):
7,994,419
Application Number:
12/167,583
OSTI ID:
1176431
Resource Relation:
Patent File Date: 2008 Jul 03
Country of Publication:
United States
Language:
English

References (9)

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High-efficiency GaInP∕GaAs∕InGaAs triple-junction solar cells grown inverted with a metamorphic bottom junction journal July 2007
High rate epitaxial lift-off of InGaP films from GaAs substrates journal April 2000
Epitaxial Lift-Off for large area thin film III/V devices journal March 2005
InGaAs/InP double heterostructures on InP/Si templates fabricated by wafer bonding and hydrogen-induced exfoliation journal December 2003