Programmable multi-chip module
Abstract
A multi-chip module comprising a low-temperature co-fired ceramic substrate having a first side on which are mounted active components and a second side on which are mounted passive components, wherein this segregation of components allows for hermetically sealing the active components with a cover while leaving accessible the passive components, and wherein the passive components are secured using a reflow soldering technique and are removable and replaceable so as to make the multi-chip module substantially programmable with regard to the passive components.
- Inventors:
- Publication Date:
- Research Org.:
- Kansas City Plant (KCP), Kansas City, MO (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1174748
- Patent Number(s):
- 6,700,196
- Application Number:
- 10/253,851
- Assignee:
- Honeywell Federal Manufacturing & Technologies (Kansas City, MO)
- DOE Contract Number:
- AC04-01AL66850
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; 42 ENGINEERING
Citation Formats
Kautz, David, Morgenstern, Howard, and Blazek, Roy J. Programmable multi-chip module. United States: N. p., 2004.
Web.
Kautz, David, Morgenstern, Howard, & Blazek, Roy J. Programmable multi-chip module. United States.
Kautz, David, Morgenstern, Howard, and Blazek, Roy J. 2004.
"Programmable multi-chip module". United States. https://www.osti.gov/servlets/purl/1174748.
@article{osti_1174748,
title = {Programmable multi-chip module},
author = {Kautz, David and Morgenstern, Howard and Blazek, Roy J.},
abstractNote = {A multi-chip module comprising a low-temperature co-fired ceramic substrate having a first side on which are mounted active components and a second side on which are mounted passive components, wherein this segregation of components allows for hermetically sealing the active components with a cover while leaving accessible the passive components, and wherein the passive components are secured using a reflow soldering technique and are removable and replaceable so as to make the multi-chip module substantially programmable with regard to the passive components.},
doi = {},
url = {https://www.osti.gov/biblio/1174748},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Mar 02 00:00:00 EST 2004},
month = {Tue Mar 02 00:00:00 EST 2004}
}
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