System configured for applying a modifying agent to a non-equidimensional substrate
The present invention is related to systems and methods for modifying various non-equidimensional substrates with modifying agents. The system comprises a processing chamber configured for passing the non-equidimensional substrate therethrough, wherein the processing chamber is further configured to accept a treatment mixture into the chamber during movement of the non-equidimensional substrate through the processing chamber. The treatment mixture can comprise of the modifying agent in a carrier medium, wherein the carrier medium is selected from the group consisting of a supercritical fluid, a near-critical fluid, a superheated fluid, a superheated liquid, and a liquefied gas. Thus, the modifying agent can be applied to the non-equidimensional substrate upon contact between the treatment mixture and the non-equidimensional substrate.
- Research Organization:
- Idaho National Laboratory (INL), Idaho Falls, ID (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC07-94ID13223
- Assignee:
- Bechtel BWXT Idaho, LLC (Idaho Falls, ID)
- Patent Number(s):
- 6,623,686
- Application Number:
- 09/677,336
- OSTI ID:
- 1174497
- Country of Publication:
- United States
- Language:
- English
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