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Title: Power Electronics Thermal Management R&D (Presentation)

Conference ·
OSTI ID:1168766

This project will investigate and develop thermal-management strategies for wide bandgap (WBG)-based power electronics systems. Research will be carried out to deal with thermal aspects at the module- and system-level. Module-level research will focus on die- and substrate-integrated cooling strategies and heat-transfer enhancement technologies. System-level research will focus on thermal-management strategies for the entire power electronics system to enable smart packaging solutions. One challenge with WBG device-based power electronics is that although losses in the form of heat may be lower, the footprint of the components is also likely to be reduced to reduce cost, weight, and volume. Combined with higher operational temperatures, this creates higher heat fluxes which much be removed from a smaller footprint, requiring advanced cooling strategies.

Research Organization:
National Renewable Energy Lab. (NREL), Golden, CO (United States)
Sponsoring Organization:
USDOE Office of Energy Efficiency and Renewable Energy Vehicle Technologies Office
DOE Contract Number:
AC36-08GO28308
OSTI ID:
1168766
Report Number(s):
NREL/PR-5400-63002
Resource Relation:
Conference: Presented at the FY15 APEEM Kickoff Meeting, 18-20 November 2014, Oak Ridge National Laboratory, Oak Ridge, Tennessee; Related Information: NREL (National Renewable Energy Laboratory)
Country of Publication:
United States
Language:
English

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