Flip Chip Assembly of Thin Substrates, Fine Bump Pitch, and Small Area Prototype Die
Conference
·
OSTI ID:1165894
- Research Organization:
- SLAC National Accelerator Lab., Menlo Park, CA (United States)
- Sponsoring Organization:
- USDOE Office of Science (SC)
- DOE Contract Number:
- AC02-76SF00515
- OSTI ID:
- 1165894
- Report Number(s):
- SLAC-PUB-16168
- Resource Relation:
- Conference: Contributed to 2014 IEEE Nuclear Science Cymposium and Medical Imaging Conference 21st Symposium on Room-Temperature Semiconductor X-ray and Gamma-ray Detectors (NSS/MIC 2014 / RTSD 2014), 08-15 Nov 2014. Seattle, WA, USA
- Country of Publication:
- United States
- Language:
- English
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