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Title: Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s)

Patent ·
OSTI ID:1165428
; ; ; ; ; ;

Cooling apparatuses and coolant-cooled electronic systems are provided which include thermal transfer structures configured to engage with a spring force one or more electronics cards with docking of the electronics card(s) within a respective socket(s) of the electronic system. A thermal transfer structure of the cooling apparatus includes a thermal spreader having a first thermal conduction surface, and a thermally conductive spring assembly coupled to the conduction surface of the thermal spreader and positioned and configured to reside between and physically couple a first surface of an electronics card to the first surface of the thermal spreader with docking of the electronics card within a socket of the electronic system. The thermal transfer structure is, in one embodiment, metallurgically bonded to a coolant-cooled structure and facilitates transfer of heat from the electronics card to coolant flowing through the coolant-cooled structure.

Research Organization:
International Business Machines Corp., Armonk, NY (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
EE0002894
Assignee:
International Business Machines Corporation (Armonk, NY)
Patent Number(s):
8,913,384
Application Number:
13/527,947
OSTI ID:
1165428
Resource Relation:
Patent File Date: 2012 Jun 20
Country of Publication:
United States
Language:
English

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Cited By (6)

Liquid-assisted bottom air cooling of electronic racks in data centers patent April 2017
Selective clamping of electronics card to coolant-cooled structure patent March 2017
Cooling apparatus with a resilient heat conducting member patent June 2016
Heat dissipation system and rack-mount server using the same patent April 2016
Thermal transfer and coolant-cooled structures facilitating cooling of electronics card(s) patent February 2016
Server memory cooling apparatus patent October 2015

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