Results of Tests of Three-Dimensionally Integrated Chips Bonded to Sensors
Journal Article
·
OSTI ID:1156568
- Research Organization:
- Fermi National Accelerator Lab. (FNAL), Batavia, IL (United States)
- Sponsoring Organization:
- USDOE Office of Science (SC), High Energy Physics (HEP)
- DOE Contract Number:
- AC02-07CH11359
- OSTI ID:
- 1156568
- Report Number(s):
- FERMILAB-PUB-14-198-PPD
- Country of Publication:
- United States
- Language:
- English
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