Thermal Performance and Reliability Characterization of Bonded Interface Materials (BIMs): Preprint

Conference · Fri Aug 01 00:00:00 EDT 2014

DOI:https://doi.org/10.1109/ITHERM.2014.6892310· OSTI ID:1150184

DeVoto, D.; Paret, P.; Mihalic, M.; Narumanchi, S.; Bar-Cohen, A.; Matin, K.

Thermal interface materials are an important enabler for low thermal resistance and reliable electronics packaging for a wide array of applications. There is a trend towards bonded interface materials (BIMs) because of their potential for low thermal resistivity (< 1 mm2K/W). However, BIMs induce thermomechanical stresses in the package and can be prone to failures and integrity risks. Deteriorated interfaces can result in high thermal resistance in the package and degradation and/or failure of the electronics. DARPA's Thermal Management Technologies program has addressed this challenge, supporting the development of mechanically-compliant, low resistivity nano-thermal interface (NTI) materials. In this work, we describe the testing procedure and report the results of NREL's thermal performance and reliability characterization of an initial sample of four different NTI-BIMs.

• Research Organization: National Renewable Energy Lab. (NREL), Golden, CO (United States)
• Sponsoring Organization: Defense Advanced Research Projects Agency (DARPA)
• DOE Contract Number: AC36-08GO28308
• OSTI ID: 1150184
• Report Number(s): NREL/CP-5400-61107
• Resource Relation: Conference: Presented at ITherm 2014, 27-30 May 2014, Orlando, Florida
• Country of Publication: United States
• Language: English

Related Subjects

33 ADVANCED PROPULSION SYSTEMS
30 DIRECT ENERGY CONVERSION
THERMAL INTERFACE
BONDED INTERFACE MATERIAL
ACCELERATED TESTING
THERMAL RESISTANCE
Transportation