Method of fabricating a cooled electronic system

Chainer, Timothy J; Gaynes, Michael A; Graybill, David P; Iyengar, Madhusudan K; Kamath, Vinod; Kochuparambil, Bejoy J; Schmidt, Roger R; Schultz, Mark D; Simco, Daniel P; Steinke, Mark E

Title: Method of fabricating a cooled electronic system

Patent · Tue Feb 11 00:00:00 EST 2014

OSTI ID:1119677

Chainer, Timothy J; Gaynes, Michael A; Graybill, David P; Iyengar, Madhusudan K; Kamath, Vinod; Kochuparambil, Bejoy J; Schmidt, Roger R; Schultz, Mark D; Simco, Daniel P; Steinke, Mark E

A method of fabricating a liquid-cooled electronic system is provided which includes an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket. The method includes providing a liquid-cooled cold rail at the one end of the socket, and a thermal spreader to couple the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.

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Research Organization:: International Business Machines Corp., Armonk, NY (United States)

Sponsoring Organization:: USDOE

DOE Contract Number:: EE0002894

Assignee:: International Business Machines Corporation (Armonk, NY)

Patent Number(s):: 8,649,177

Application Number:: 13/451,714

OSTI ID:: 1119677

Country of Publication:: United States

Language:: English

References (69)

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