Method and apparatus for improved high power impulse magnetron sputtering
Patent
·
OSTI ID:1107879
A high power impulse magnetron sputtering apparatus and method using a vacuum chamber with a magnetron target and a substrate positioned in the vacuum chamber. A field coil being positioned between the magnetron target and substrate, and a pulsed power supply and/or a coil bias power supply connected to the field coil. The pulsed power supply connected to the field coil, and the pulsed power supply outputting power pulse widths of greater that 100 .mu.s.
- Research Organization:
- Lawrence Berkeley National Laboratory (LBNL), Berkeley, CA (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC02-05CH11231
- Assignee:
- The Regents of the University of California (Oakland, CA)
- Patent Number(s):
- 8,574,410
- Application Number:
- 12/989,378
- OSTI ID:
- 1107879
- Country of Publication:
- United States
- Language:
- English
Linear magnetron arc evaporation or sputtering source
|
patent | February 2002 |
Process and apparatus for coating conducting pieces using a pulsed glow discharge
|
patent | May 1991 |
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