Encapsulation methods and dielectric layers for organic electrical devices

Blum, Yigal D; Chu, William Siu-Keung; MacQueen, David Brent; Shi, Yijan

Title: Encapsulation methods and dielectric layers for organic electrical devices

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Abstract

The disclosure provides methods and materials suitable for use as encapsulation barriers and dielectric layers in electronic devices. In one embodiment, for example, there is provided an electroluminescent device or other electronic device with a dielectric layer comprising alternating layers of a silicon-containing bonding material and a ceramic material. The methods provide, for example, electronic devices with increased stability and shelf-life. The invention is useful, for example, in the field of microelectronic devices.

Inventors:: Blum, Yigal D; Chu, William Siu-Keung; MacQueen, David Brent; Shi, Yijan

Publication Date:: Tue Jul 02 00:00:00 EDT 2013

Research Org.:: SRI International (Menlo Park, CA)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1086738

Patent Number(s):: 8,476,119

Application Number:: 13/202,065

Assignee:: SRI International (Menlo Park, CA)

DOE Contract Number:: FC26-06NT42936

Resource Type:: Patent

Country of Publication:: United States

Language:: English

Subject:: 42 ENGINEERING; 36 MATERIALS SCIENCE

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                    Blum, Yigal D, Chu, William Siu-Keung, MacQueen, David Brent, and Shi, Yijan. Encapsulation methods and dielectric layers for organic electrical devices.  United States: N. p., 2013. 
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                    Blum, Yigal D, Chu, William Siu-Keung, MacQueen, David Brent, & Shi, Yijan. Encapsulation methods and dielectric layers for organic electrical devices.  United States.

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                    Blum, Yigal D, Chu, William Siu-Keung, MacQueen, David Brent, and Shi, Yijan. 2013.  
        "Encapsulation methods and dielectric layers for organic electrical devices".  United States.  https://www.osti.gov/servlets/purl/1086738.

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@article{osti_1086738,

  title        = {Encapsulation methods and dielectric layers for organic electrical devices},

  author       = {Blum, Yigal D and Chu, William Siu-Keung and MacQueen, David Brent and Shi, Yijan},

  abstractNote = {The disclosure provides methods and materials suitable for use as encapsulation barriers and dielectric layers in electronic devices. In one embodiment, for example, there is provided an electroluminescent device or other electronic device with a dielectric layer comprising alternating layers of a silicon-containing bonding material and a ceramic material. The methods provide, for example, electronic devices with increased stability and shelf-life. The invention is useful, for example, in the field of microelectronic devices.},

  doi          = {},

  url          = {https://www.osti.gov/biblio/1086738},
  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {Tue Jul 02 00:00:00 EDT 2013},

  month        = {Tue Jul 02 00:00:00 EDT 2013}

}

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