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Title: Method of manufacturing a shapeable short-resistant capacitor

Patent ·
OSTI ID:1083937

A method that employs a novel combination of conventional fabrication techniques provides a ceramic short-resistant capacitor that is bendable and/or shapeable to provide a multiple layer capacitor that is extremely compact and amenable to desirable geometries. The method allows thinner and more flexible ceramic capacitors to be made. The method includes forming a first thin metal layer on a substrate; depositing a thin, ceramic dielectric layer over the metal layer; depositing a second thin metal layer over the dielectric layer to form a capacitor exhibiting a benign failure mode; and separating the capacitor from the substrate. The method may also include bending the resulting capacitor into a serpentine arrangement with gaps between the layers that allow venting of evaporated electrode material in the event of a benign failure.

Research Organization:
Argonne National Laboratory (ANL), Argonne, IL (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
CRADA Number 070080
Assignee:
Delphi Technologies, Inc. (Troy, MI)
Patent Number(s):
8,407,871
Application Number:
12/498,025
OSTI ID:
1083937
Country of Publication:
United States
Language:
English

References (8)

Method of producing a tantalum thin film capacitor patent November 1977
Multi-chip circuit module and method for producing the same patent March 2007
Method of making a multi-layered article patent July 1991
Thermal shock resistance ceramic insulator patent November 1980
Method for forming a reinforced tip for a probe storage device patent May 2008
Methods of forming capacitors including reducing exposed electrodes in semiconductor devices patent February 2005
Low k dielectric materials with inherent copper ion migration barrier patent July 2002
Ceramic capacitor exhibiting graceful failure by self-clearing, method for fabricating self-clearing capacitor patent August 2006

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