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Title: Rapid thermal processing by stamping

Patent ·
OSTI ID:1083459

A rapid thermal processing device and methods are provided for thermal processing of samples such as semiconductor wafers. The device has components including a stamp (35) having a stamping surface and a heater or cooler (40) to bring it to a selected processing temperature, a sample holder (20) for holding a sample (10) in position for intimate contact with the stamping surface; and positioning components (25) for moving the stamping surface and the stamp (35) in and away from intimate, substantially non-pressured contact. Methods for using and making such devices are also provided. These devices and methods allow inexpensive, efficient, easily controllable thermal processing.

Research Organization:
National Renewable Energy Laboratory (NREL), Golden, CO (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
AC36-99G010337
Assignee:
Alliance for Sustainable Energy, LLC (Golden, CO)
Patent Number(s):
8,389,422
Application Number:
12/675,117
OSTI ID:
1083459
Country of Publication:
United States
Language:
English

References (10)

Speaker adapted to corner-loaded installation patent February 1986
Solution deposition of chalcogenide films patent April 2005
Method for forming polycrystalline silicon from the crystallization of microcrystalline silicon patent October 1998
Solid phase crystallization of thin films of Si prepared by plasma‐enhanced chemical vapor deposition journal July 1993
Method for heating and cooling substrates patent December 2003
Light management film with colorant receiving layer patent November 2004
Thermal stamping apparatus patent December 1980
Thermal stamping device patent April 1981
Pressure controlled heat source and method for using such for RTP patent May 2004
Machine tool for stamping, nibbling and thermal cutting and the like patent April 1986

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