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Title: Apparatuses and methods for removal of ink buildup

Patent ·
OSTI ID:1083064

A substrate patterning method including the steps of spraying ink on a surface of a substrate, the spraying of the ink resulting in an overspray of excess ink past an edge of the substrate; changing a temperature of the excess ink to cause a change in a viscosity of the excess ink; and removing the excess ink having the changed viscosity.

Research Organization:
SunPower Corporation, San Jose, CA (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
FC36-07GO17043
Assignee:
SunPower Corporation (San Jose, CA)
Patent Number(s):
8,393,707
Application Number:
12/862,086
OSTI ID:
1083064
Country of Publication:
United States
Language:
English

References (8)

Molding technique for fabrication of optoelectronic devices patent August 2007
Dopant material for manufacturing solar cells patent-application April 2009
Liquid ink development control patent October 2000
Overspray guard for a screen printing machine patent September 2005
Liquid ejection head and liquid ejection apparatus patent April 2009
Precursor Compositions and Methods for the Deposition of Passive Electrical Components on a Substrate patent-application September 2003
Image forming apparatus having heating and cooling units patent October 2002
Solar cell having polymer heterojunction contacts patent-application July 2007

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