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Title: Method of producing an electronic unit having a polydimethylsiloxane substrate and circuit lines

Patent ·
OSTI ID:1055505

A system of metalization in an integrated polymer microsystem. A flexible polymer substrate is provided and conductive ink is applied to the substrate. In one embodiment the flexible polymer substrate is silicone. In another embodiment the flexible polymer substrate comprises poly(dimethylsiloxane).

Research Organization:
Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
W-7405-ENG-48
Assignee:
Lawrence Livermore National Security, LLC (Livermore, CA)
Patent Number(s):
8,202,566
Application Number:
11/243,302
OSTI ID:
1055505
Country of Publication:
United States
Language:
English