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Title: Unique Methodologies for Nano/Micro Manufacturing Job Training Via Desktop Supercomputer Modeling and Simulation

Technical Report ·
DOI:https://doi.org/10.2172/1055326· OSTI ID:1055326

This project establishes an initiative in high speed (Teraflop)/large-memory desktop supercomputing for modeling and simulation of dynamic processes important for energy and industrial applications. It provides a training ground for employment of current students in an emerging field with skills necessary to access the large supercomputing systems now present at DOE laboratories. It also provides a foundation for NIU faculty to quantum leap beyond their current small cluster facilities. The funding extends faculty and student capability to a new level of analytic skills with concomitant publication avenues. The components of the Hewlett Packard computer obtained by the DOE funds create a hybrid combination of a Graphics Processing System (12 GPU/Teraflops) and a Beowulf CPU system (144 CPU), the first expandable via the NIU GAEA system to ~60 Teraflops integrated with a 720 CPU Beowulf system. The software is based on access to the NVIDIA/CUDA library and the ability through MATLAB multiple licenses to create additional local programs. A number of existing programs are being transferred to the CPU Beowulf Cluster. Since the expertise necessary to create the parallel processing applications has recently been obtained at NIU, this effort for software development is in an early stage. The educational program has been initiated via formal tutorials and classroom curricula designed for the coming year. Specifically, the cost focus was on hardware acquisitions and appointment of graduate students for a wide range of applications in engineering, physics and computer science.

Research Organization:
Northern Illinois Univ., DeKalb, IL (United States)
Sponsoring Organization:
USDOE Office of Science (SC), Biological and Environmental Research (BER)
DOE Contract Number:
SC0005135
OSTI ID:
1055326
Report Number(s):
DE-SC0005135
Country of Publication:
United States
Language:
English

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