Chemical vapor deposition and characterization of tungsten boron alloy films
- Sandia National Labs., Albuquerque, NM (United States)
- California Inst. of Tech., Pasadena, CA (United States)
- Schumacher, Carlsbad, CA (United States)
A low pressure chemical vapor deposition (LPCVD) process for depositing W{sub X}B{sub (1-X)} films from WF{sub 6} and B{sub 2}H{sub 6} is described. The depositions were performed in a cold wall reactor on 6 in. Si wafers at 400C. During deposition, pressure was maintained at a fixed level in the range of 200 to 260 mTorr. Ratio of WF{sub 6}/B{sub 2}H{sub 6} was varied from 0.05 to 1.07. Carrier gas was either 100 sccm of Ar with a gas flow of 308 to 591 sccm, or 2000 sccm of Ar and 2000 sccm of H{sub 2} with the overall gas flow from 4213 to 4452 sccm. Two stable deposition regions were found separated by an unstable region that produced non-uniform films. The B-rich films produced in one of the stable deposition regions had W concentrations of 30 at.% and resistivities between 200 and 300 {mu}ohm{center_dot}cm. The W-rich films produced in the other stable deposition region had W concentrations of 80 at.% and resistivities of 100 {mu}ohm{center_dot}cm. As-deposited films had densities similar to bulk material of similar stoichiometry. Barrier properties of the films against diffusion of Cu to 700C in vacuum were measured by 4-point probe. Also, annealing was carried out to 900C in order to determine phases formed as the films crystallize. These studies indicate that W{sub X}B{sub (1-X)} films may be useful barriers in ULSI metallization applications.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 10194458
- Report Number(s):
- SAND-93-2445C; CONF-9310218-1; ON: DE94002648; BR: GB0103012
- Resource Relation:
- Conference: Advanced metalization for ultralarge scale integration applications in 1993,San Diego, CA (United States),5-10 Oct 1993; Other Information: PBD: [1993]
- Country of Publication:
- United States
- Language:
- English
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