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Title: Motion planning for robotic spray cleaning with environmentally safe solvents

Conference ·
OSTI ID:10191630

Automatic motion planning of a spray cleaning robot with collision avoidance is presented in this paper. In manufacturing environments, electronic and mechanical components are traditionally cleaned by spraying or dipping them using chlorofluorocarbon (CFC) solvents. As new scientific data show that such solvents are major causes for stratospheric ozone depletion, an alternate cleaning method is needed. Part cleaning with aqueous solvents is environmentally safe, but can require precision spraying at high pressures for extended time periods. Operator fatigue during manual spraying can decrease the quality of the cleaning process. By spraying with a robotic manipulator, the necessary spray accuracy and consistency to manufacture highreliability components can be obtained. Our motion planner was developed to automatically generate motions for spraying robots based on the part geometry and cleaning process parameters. For spraying paint and other coatings a geometric description of the parts and robot may be sufficient for motion planning, since coatings are usually done over the visible surfaces. For spray cleaning, the requirement to reach hidden surfaces necessitates the addition of a rule-based method to the geometric motion planning.

Research Organization:
Sandia National Labs., Albuquerque, NM (United States)
Sponsoring Organization:
USDOE, Washington, DC (United States)
DOE Contract Number:
AC04-76DP00789
OSTI ID:
10191630
Report Number(s):
SAND-93-2026C; CONF-9311103-1; ON: DE93041140
Resource Relation:
Conference: Institute of Electrical and Electronics Engineers (IEEE) and Tsukuba international workshop on advanced robotics,Tsukuba (Japan),8-9 Nov 1993; Other Information: PBD: [1993]
Country of Publication:
United States
Language:
English