Technologies for highly parallel optoelectronic integrated circuits
- Sandia National Labs., Albuquerque, NM (United States). Photonics Research Dept.
While summarily reviewing the range of optoelectronic integrated circuits (OEICs), this paper emphasizes technology for highly parallel optical interconnections. Market volume and integration suitability considerations highlight board-to-board interconnects within systems as an initial insertion point for large OEIC production. The large channel count of these intrasystem interconnects necessitates two-dimensional laser transmitter and photoreceiver arrays. Surface normal optoelectronic components are promoted as a basis for OEICs in this application. An example system is discussed that uses vertical cavity surface emitting lasers for optical buses between layers of stacked multichip modules. Another potentially important application for highly parallel OEICs is optical routing or packet switching, and examples of such systems based on smart pixels are presented.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 10189750
- Report Number(s):
- SAND-94-2349C; CONF-9410195-2; ON: DE95001607; BR: GB0103012; TRN: AHC29426%%61
- Resource Relation:
- Conference: GaAs symposium,Philadelphia, PA (United States),16-19 Oct 1994; Other Information: PBD: [1994]
- Country of Publication:
- United States
- Language:
- English
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