skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Magnetically controlled deposition of metals using gas plasma. Quarterly progress report, April--June 1994

Technical Report ·
DOI:https://doi.org/10.2172/10183444· OSTI ID:10183444

Thin layers of secondary material are plated on substrates either by plating or spraying processes. Plating operations produce large amounts of hazardous liquid wastes. Spraying, while one of the less waste intensive methods, produces ``over spray`` which is waste that is a result of the uncontrolled nature of the spray stream. In many cases the over spray produces a hazardous waste. Spray coating is a mature process with many uses. Material can be deposited utilizing spraying technology in three basic ways: ``Flame spraying;`` direct spraying of molten metals; and/or plasma spraying. This project is directed at controlling the plasma spraying process and thereby minimizing the waste generated in that process. Examples of spraying applications that may benefit substantially from this technology are: (1) preparing printed circuit boards; and (2) tinning circuit boards with lead in preparation for soldering components. There are many applications of spraying technology that can benefit from a controlled spraying scheme. They include: (1) titanium coating on bio-implants; (2) wear-tolerant ceramic thermal barriers using partially stabilized zirconia (PSZ); (3) alumina and alumina-titania wear resistant-coatings: and (4) ceramic superconductor manufacture using Hollow Spherical Powders.

Research Organization:
Idaho Univ., Moscow, ID (United States). Dept. of Mechanical Engineering
Sponsoring Organization:
USDOE, Washington, DC (United States)
DOE Contract Number:
FG07-93ID13220
OSTI ID:
10183444
Report Number(s):
DOE/ID/13220-T1; ON: DE94018654; BR: EW4035200; TRN: AHC29421%%189
Resource Relation:
Other Information: PBD: Jul 1994
Country of Publication:
United States
Language:
English