Optoelectronic packaging: A review

Conference · Wed Sep 01 00:00:00 EDT 1993

OSTI ID:10181414

Carson, R F

Optoelectronics and photonics hold great potential for high data-rate communication and computing. Wide using in computing applications was limited first by device technologies and now suffers due to the need for high-precision, mass-produced packaging. The use of phontons as a medium of communication and control implies a unique set of packaging constraints that was not present in traditional telecommunications applications. The state-of-the-art in optoelectronic packaging is now driven by microelectric techniques that have potential for low cost and high volume manufacturing.

• Research Organization: Sandia National Labs., Albuquerque, NM (United States)
• Sponsoring Organization: USDOE, Washington, DC (United States)
• DOE Contract Number: AC04-76DP00789
• OSTI ID: 10181414
• Report Number(s): SAND-93-1990C; CONF-931121-20; ON: DE93040059
• Resource Relation: Conference: Annual winter meeting of the American Society of Mechanical Engineers,New Orleans, LA (United States),28 Nov - 3 Dec 1993; Other Information: PBD: [1993]
• Country of Publication: United States
• Language: English

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MICROELECTRONICS
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GALLIUM PHOSPHIDES
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INDIUM ARSENIDES
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990200
426000
MATHEMATICS AND COMPUTERS
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