Mixed-sputter deposition of Ni-Ti-Cu shape memory films

Technical Report · Sun May 01 00:00:00 EDT 1994

DOI:https://doi.org/10.2172/10176050· OSTI ID:10176050

Krulevitch, P; Ramsey, P B; Makowiecki, D M; Lee, A P; Northrup, M A ^[1]; Johnson, G C ^[2]

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1. Lawrence Livermore National Lab., CA (United States)
2. California Univ., Berkeley, CA (United States). Dept. of Mechanical Engineering

Ni-Ti-Cu shape memory films were mixed-sputter deposited from separate nickel, titanium, and copper targets, providing increased compositional flexibility. Shape memory characteristics, examined for films with 7 at. % Cu and 41--51 at. % Tl, were determined with temperature controlled substrate curvature measurements, and microstructure was studied with transmission electron microscopy. The Ni-Ti-Cu films were found to have shape memory properties comparable to bulk materials, with transformation temperatures between 20 and 62{degree}C, a 10--13{degree}C hysteresis, and up to 330 MPa recoverable stress.

• Research Organization: Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
• Sponsoring Organization: USDOE, Washington, DC (United States); National Science Foundation, Washington, DC (United States)
• DOE Contract Number: W-7405-ENG-48
• OSTI ID: 10176050
• Report Number(s): UCRL-ID-115719; ON: DE94017296
• Resource Relation: Other Information: PBD: May 1994
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
NICKEL ALLOYS
SHAPE MEMORY EFFECT
TITANIUM ALLOYS
COPPER ALLOYS
FILMS
MICROSTRUCTURE
SPUTTERING
360104
PHYSICAL PROPERTIES