A method for reducing encapsulation stress to ferrite pot cores
Conference
·
OSTI ID:10170216
This paper describes a method of reducing the mechanical stress caused when a ferrite pot core is encapsulated in a rigid epoxy. the stresses are due to the differences of coefficient of thermal expansion between the two materials. A stress relief medium, phenolic micro-balloon-filled, syntactic polysulfide, is molded into the shape of the pot core. The molded polysulfide is bonded to the core prior to encapsulation. The new package design has made a significant difference in the ability to survive temperature cycles.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 10170216
- Report Number(s):
- SAND-94-1956C; CONF-9409166-2; ON: DE94015895; BR: GB0103012
- Resource Relation:
- Conference: Electrical manufacturing and coil winding conference,Chicago, IL (United States),27 Sep 1994; Other Information: PBD: [1994]
- Country of Publication:
- United States
- Language:
- English
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