Elimination of internal contamination on semiconductor devices (protective coatings). Final report
Characterization results are described of epoxy and gel coatings that were applied to leadless chip carriers (LCC) and TO-46 semiconductor packages. Samples included silicon dioxide, liquid epoxy, epoxy, RTV silicon, and silicon gel; and a standard test sequence was followed. Test results and coating application feasibility for semiconductor packages and military applications are discussed.
- Research Organization:
- Allied-Signal Aerospace Co., Kansas City, MO (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-76DP00613
- OSTI ID:
- 10170074
- Report Number(s):
- KCP-613-5433; ON: DE94015868
- Resource Relation:
- Other Information: PBD: Jul 1994
- Country of Publication:
- United States
- Language:
- English
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