Development of alternatives to lead-bearing solders

Conference · Thu Jul 01 00:00:00 EDT 1993

OSTI ID:10169303

Vianco, P T ^[1]

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1. Sandia National Labs., Albuquerque, NM (United States)

Soldering technology, using tin-lead alloys has had a significant role in the packaging of highly functional, low cost electronic devices. The elimination of lead from all manufactured products, whether through legislation or tax incentives, will impact the electronics community which uses lead-containing solders. In response to these proposed measures, the National Center for Manufacturing Sciences has established a multi-year program involving participants from industry, academia, and the national laboratories with the objective to identify potential replacements for lead-bearing solders. Selection of candidate alloys is based upon the analysis of materials properties, manufacturability, modeling codes for reliability prediction, as well as toxicological properties and resource availability, data developed in the program.

• Research Organization: Sandia National Labs., Albuquerque, NM (United States); National Center for Mfg. Sciences, Ann Arbor, MI (United States)
• Sponsoring Organization: USDOE, Washington, DC (United States)
• DOE Contract Number: AC04-76DP00789
• OSTI ID: 10169303
• Report Number(s): SAND-93-0225C; CONF-9308126-1; ON: DE93016509
• Resource Relation: Conference: Surface Mount Technical Association international conference,San Jose, CA (United States),31 Aug - 2 Sep 1993; Other Information: PBD: 1993
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
99 GENERAL AND MISCELLANEOUS//MATHEMATICS, COMPUTING, AND INFORMATION SCIENCE
SOLDERING
METALLURGICAL FLUX
MATERIAL SUBSTITUTION
MICROELECTRONIC CIRCUITS
LEAD ALLOYS
TIN ALLOYS
PRINTED CIRCUITS
ENVIRONMENTAL EFFECTS
REGULATIONS
EVALUATION
FEASIBILITY STUDIES
TOXICITY
426000
570000
COMPONENTS
ELECTRON DEVICES AND CIRCUITS
HEALTH AND SAFETY