Doped LZO buffer layers for laminated conductors

Patent · Tue Mar 23 00:00:00 EDT 2010

OSTI ID:1014465

Paranthaman, Mariappan Parans ^[1]; Schoop, Urs ^[2]; Goyal, Amit ^[1]; Thieme, Cornelis Leo Hans ^[2]; Verebelyi, Darren T ^[3]; Rupich, Martin W ^[4]

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1. Knoxville, TN
2. Westborough, MA
3. Oxford, MA
4. Framingham, MA

A laminated conductor includes a metallic substrate having a surface, a biaxially textured buffer layer supported by the surface of the substrate, the biaxially textured buffer layer comprising LZO and a dopant for mitigating metal diffusion through the LZO, and a biaxially textured conductor layer supported by the biaxially textured buffer layer.

• Research Organization: Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
• Sponsoring Organization: USDOE
• DOE Contract Number: AC05-00OR22725
• Assignee: UT-Battelle, LLC (Oak Ridge, TN)
• Patent Number(s): 7,683,010
• Application Number: U S Patent Application 11/192,487
• OSTI ID: 1014465
• Country of Publication: United States
• Language: English