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Title: The influence of temperature and humidity on the wettability of immersion tin coated printed wiring boards

Conference ·
OSTI ID:10136209
;  [1];  [2]
  1. AT and T Bell Labs., Princeton, NJ (United States)
  2. Sandia National Labs., Albuquerque, NM (United States)

This paper investigates the merits and drawbacks of immersion tin coatings as potential printed wiring board (PWB) surface finishes. Immersion tin films applied in various thicknesses (0.2 to 2 {mu}m) to different copper substrates were characterized relative to thermal stability and shelflife. Thermal excursions included those typical in mixed technology assembly processes. Exposure to temperature/humidity was varied from near ambient (35{degree}C/85%RH) to harsh (steam aging). A minimum thickness of {approximately}60{mu}in (1.5{mu}m) was determined to be critical for assembly operations involving multiple thermal excursions. Even though formation of Cu-Sn intermetallic compounds (IMC) is facile, at the copper-tin interface, these compounds do not adversely affect the soldering performance, as long as the IMC phase is protected by a tin surface layer. Immersion tin finishes are relatively stable to thermal exposure, but are readily oxidized in the presence of humidity. This oxide growth is directly responsible for solderability degradation. The underlying copper substrate was also found to have a significant impact on the thermal stability of tin films. An electroless copper substrate caused significantly more intermetallic formation, that resulted in poor solderability even under moderate temperature, humidity conditions.

Research Organization:
Sandia National Labs., Albuquerque, NM (United States)
Sponsoring Organization:
USDOE, Washington, DC (United States)
DOE Contract Number:
AC04-94AL85000
OSTI ID:
10136209
Report Number(s):
SAND-93-2585C; CONF-940596-3; ON: DE94008947; BR: GB0103012
Resource Relation:
Conference: 44. electronic components and technology conference,Washington, DC (United States),1-4 May 1994; Other Information: PBD: [1993]
Country of Publication:
United States
Language:
English