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Title: Ion beam synthesis of IrSi{sub 3} by 1-MeV Ir ion implantation into Si(111)

Conference ·
OSTI ID:10122582
 [1];  [2]
  1. Oak Ridge National Lab., TN (United States)
  2. Forschungszentrum Juelich GmbH (Germany)

The formation of a Si/IrSi{sub 3}/Si heterostructure by 1-MeV Ir ion implantation and subsequent annealing has been studied for different doses (0.1--2.25 {times} 10{sup 17} Ir/cm{sup 2}), substrate temperatures (450--600C) and annealing temperatures (1000--1200C) using Rutherford backscattering spectrometry, ion channeling and cross-sectional transmission electron microscopy. The heterostructure formation is observed to depend strongly on the processing conditions. The best structure, nearly continuous and precipitate-free, is obtained by implanting 1.8--2.0 {times} 10{sup 17} Ir/cm{sup 2} at a substrate temperature of 550C and annealing at 1100C for 5 h. A stoichiometric IrSi{sub 3} layer can also be produced by furnace annealing at 1150C for 1 h or by rapid-thermal-annealing at 1200C for 3 min. Other substrate temperatures generally lead to a structure with a discontinuous IrSi{sub 3} layer frequently interrupted by large surface precipitates or islands. Origin of these islands, as well as dependence of heterostructure on processing parameters, is discussed.

Research Organization:
Oak Ridge National Lab., TN (United States)
Sponsoring Organization:
USDOE, Washington, DC (United States)
DOE Contract Number:
AC05-84OR21400
OSTI ID:
10122582
Report Number(s):
CONF-931108-76; ON: DE94006556
Resource Relation:
Conference: Fall meeting of the Materials Research Society (MRS),Boston, MA (United States),29 Nov - 3 Dec 1993; Other Information: PBD: Nov 1993
Country of Publication:
United States
Language:
English