High-lift chemical heat pump technologies for industrial processes
Traditionally industrial heat pumps (IHPs) have found applications on a process specific basis with reject heat from a process being upgraded and returned to the process. The IHP must be carefully integrated into a process since improper placement may result in an uneconomic application. Industry has emphasized a process integration approach to the design and operation of their plants. Heat pump applications have adopted this approach and the area of applicability was extended by utilizing a process integrated approach where reject heat from one process is upgraded and then used as input for another process. The DOE IHP Program has extended the process integration approach of heat pump application with a plant utility emphasis. In this design philosophy, reject heat from a process is upgraded to plant utility conditions and fed into the plant distribution system. This approach has the advantage that reject heat from any pr@s can be used as input and the output can be used at any location within the plant. Thus the approach can be easily integrated into existing industrial applications and all reject heat streams are potential targets of opportunity. The plant utility approach can not be implemented without having heat pumps with high-lift capabilities (on the order of 65{degree}C). Current heat pumps have only about half the lift capability required. Thus the current emphasis for the DOE IHP Program is the development of high lift chemical heat pumps that can deliver heat more economically to higher heat delivery temperatures. This is achieved with innovative cooling (refrigeration) and heating technologies which are based on advanced cycles and advanced working fluids or a combination of both. This paper details the plan to develop economically competitive, environmentally acceptable heat pump technologies that are capable of providing the delivery temperature and lift required to supply industrial plant utility-grade process heating and/or cooling.
- Research Organization:
- Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC05-84OR21400
- OSTI ID:
- 100092
- Report Number(s):
- CONF-951135-3; ON: DE95012845
- Resource Relation:
- Conference: 1995 International mechanical engineering congress and exhibition, San Francisco, CA (United States), 12-17 Nov 1995; Other Information: PBD: Mar 1995
- Country of Publication:
- United States
- Language:
- English
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