Vertically Integrated Circuits at Fermilab
The exploration of vertically integrated circuits, also commonly known as 3D-IC technology, for applications in radiation detection started at Fermilab in 2006. This paper examines the opportunities that vertical integration offers by looking at various 3D designs that have been completed by Fermilab. The emphasis is on opportunities that are presented by through silicon vias (TSV), wafer and circuit thinning, and finally fusion bonding techniques to replace conventional bump bonding. Early work by Fermilab has led to an international consortium for the development of 3D-IC circuits for High Energy Physics. For the first time, Fermilab has organized a 3D MPW run, to which more than 25 different designs have been submitted by the consortium.
- Research Organization:
- Fermi National Accelerator Lab. (FNAL), Batavia, IL (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC02-07CH11359
- OSTI ID:
- 985960
- Report Number(s):
- FERMILAB-PUB-10-314-PPD; IETNAE; TRN: US201017%%112
- Journal Information:
- IEEE Trans.Nucl.Sci.57:2178-2186,2010, Vol. 57, Issue 4; ISSN 0018-9499
- Country of Publication:
- United States
- Language:
- English
Similar Records
3D design activities at Fermilab: Opportunities for physics
3D integration of high-density CMOS circuits to high resistivity silicon detector layer