Thermal Properties of Wood-Derived Copper-Silicon Carbide Compsites Fabricated Via Electrodeposition

Journal Article · Fri Jan 01 00:00:00 EST 2010 · Composites Science and Technology

DOI:https://doi.org/10.1016/j.compscitech.2009.11.011· OSTI ID:973841

Pappacena, Kristen E ^[1]; Johnson, M. T. ^[2]; Wang, Hsin ^[1]; Porter, Wallace D ^[1]; Faber, K. T. ^[2]

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1. ORNL
2. Northwestern University, Evanston

Copper-silicon carbide composites were fabricated by electrodeposition of copper into pores of wood-derived silicon carbide, a ceramic with a microstructure that can be tailored via the use of different wood precursors. Thermal conductivity values were determined using flash diffusivity at temperatures from 0 to 900 C. Thermal conductivities of up to 202 W/m K at 0 C and 148 W/mK at 900 C were achieved. Object-oriented finite-element analysis (OOF) modeling was used to understand the heat flux distributions throughout the microstructures. OOF was also used to calculate the effective thermal conductivity, which correlated well with experimentally-determined values for axially-oriented composites. In addition, OOF was used to predict effective conductivity values and heat flux distributions for transversely-oriented composites.

• Research Organization: Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States). High Temperature Materials Lab. (HTML)
• Sponsoring Organization: USDOE Office of Energy Efficiency and Renewable Energy (EERE)
• DOE Contract Number: DE-AC05-00OR22725
• OSTI ID: 973841
• Journal Information: Composites Science and Technology, Vol. 70, Issue 10; ISSN 0266-3538
• Country of Publication: United States
• Language: English

Related Subjects

09 BIOMASS FUELS
CARBIDES
CERAMICS
COPPER
ELECTRODEPOSITION
HEAT FLUX
MICROSTRUCTURE
SILICON CARBIDES
SIMULATION
THERMAL CONDUCTIVITY
THERMODYNAMIC PROPERTIES
WOOD