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Title: Sublimation Growth of Titanium Nitride Crystals

Journal Article · · Journal of Materials Science: Materials in Electronics
OSTI ID:969658

The sublimation-recondensation growth of titanium nitride crystal with N/Ti ratio of 0.99 on tungsten substrate is reported. The growth rate dependence on temperature and pressure was determined, and the calculated activation energy is 775.8 29.8kJ/mol. The lateral and vertical growth rates changed with the time of growth and the fraction of the tungsten substrate surface covered. The orientation relationship of TiN (001) || W (001) with TiN [100] || W [110], a 45o angle between TiN [100] and W [100], occurs not only for TiN crystals deposited on W (001) textured tungsten but also for TiN crystals deposited on randomly orientated tungsten. This study demonstrates that this preferred orientational relationship minimizes the lattice mismatch between the TiN and tungsten.

Research Organization:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States). High Temperature Materials Lab. (HTML); Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States). Shared Research Equipment Collaborative Research Center
Sponsoring Organization:
USDOE Office of Science (SC)
DOE Contract Number:
DE-AC05-00OR22725
OSTI ID:
969658
Journal Information:
Journal of Materials Science: Materials in Electronics, Vol. 21, Issue 1
Country of Publication:
United States
Language:
English