Characterization of metallic foil joints using diffusion bonding and diffusion soldering in micro-technology-based energy and chemical systems

Conference · Mon Jan 01 00:00:00 EST 2001

OSTI ID:923534

Gabriel, Michael ^[1]; Paul, B K ^[1]; Wilson, R D

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1. Oregon State Univ., Corvallis, OR

The several 316 stainless steel mesoscopic devices were made using diffusing bonding and diffusion soldering. Tensile strength, pressure drop of the devices were measured, and metallurgical examinations were made of the joints. Continuous bonds were observed in both diffusion bonded and diffusion soldered samples. Strengths of the diffusion soldered samples were up to 80% of the strength of the Ag3Sn joint material or 125 MPa. The pressure drop in diffusion soldered samples was 0.76 psi at the highest flow rates of 2.08 L/min. Diffusion bonded joints had strengths of up to 700 MPa but the back pressures were higher at all flow rates.

• Research Organization: Oregon State University, Corvallis, OR; Albany Research Center (ARC), Albany, OR (United States)
• Sponsoring Organization: Oregon State University, Corvallis, OR; USDOE - Office of Fossil Energy (FE)
• DOE Contract Number: Not cited
• OSTI ID: 923534
• Report Number(s): DOE/ARC-2001-132
• Resource Relation: Conference: 29th North American Manufacturing Research Conference (NAMRC XXIX), Gainesville, FL, May 22-25, 2001
• Country of Publication: United States
• Language: English