Ultra-Low-Background Copper Production and Clean Fabrication
Conference
·
OSTI ID:881700
Commercial high-purity copper is an attractive material for constructing ultra-low-background radiation measurement devices. When even higher purity is desired, additional electrolytic and chemical purification can be combined with the final fabrication step. This process results in ''electroformed'' copper parts of extreme purity. Copper electroforming can be done underground, providing a way to eliminate cosmogenic activation products seen in copper that has had above-ground exposure. A brief summary of the history, cosmogenics, process chemistry, cleaning, and passivation of this material is given. Examples of finished parts illustrate the method. The required infrastructure is summarized.
- Research Organization:
- Pacific Northwest National Lab. (PNNL), Richland, WA (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC05-76RL01830
- OSTI ID:
- 881700
- Report Number(s):
- PNNL-SA-45365; NN2003000; TRN: US200613%%76
- Resource Relation:
- Conference: Topical Workshop on Low Radioactivity Techniques: LRT 2004 Sudbury, Ontario (Canada), 12-14 December 2004. , 785(1):170-176
- Country of Publication:
- United States
- Language:
- English
Similar Records
Ultra-Low-Background Copper Production and Clean Fabrication
Reduction of Radioactive Backgrounds in Electroformed Copper for Ultra-Sensitive Radiation Detectors
Manufacturing of low-background copper electrical components for rare-event detection. Final report
Journal Article
·
Thu Sep 08 00:00:00 EDT 2005
· AIP Conference Proceedings
·
OSTI ID:881700
+4 more
Reduction of Radioactive Backgrounds in Electroformed Copper for Ultra-Sensitive Radiation Detectors
Journal Article
·
Mon Jul 07 00:00:00 EDT 2014
· Nuclear Instruments and Methods in Physics Research. Section A, Accelerators, Spectrometers, Detectors and Associated Equipment
·
OSTI ID:881700
+5 more
Manufacturing of low-background copper electrical components for rare-event detection. Final report
Technical Report
·
Tue Jan 15 00:00:00 EST 2019
·
OSTI ID:881700