Metallic coatings for enhancement of thermal contact conductance

Journal Article · Fri Apr 01 00:00:00 EST 1994 · Journal of Thermophysics and Heat Transfer; (United States)

DOI:https://doi.org/10.2514/3.544· OSTI ID:7244250

Lambert, M A; Fletcher, L S ^[1]

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1. Texas A M Univ., College Station, TX (United States)

The reliability of standard electronic modules may be improved by decreasing overall module temperature. This may be accomplished by enhancing the thermal contact conductance at the interface between the module frame guide rib and the card rail to which the module is clamped. Some metallic coatings, when applied to the card rail, would deform under load, increasing the contact area and associated conductance. This investigation evaluates the enhancements in thermal conductance afforded by vapor deposited silver and gold coatings. Experimental thermal conductance measurements were made for anodized aluminum 6101-T6 and electroless nickel-plated copper C11000-H03 card materials to the aluminum A356-T61 rail material. Conductance values for the electroless nickel-plated copper junction ranged from 600 to 2800 W/m(exp 2)K and those for the anodized aluminum junction ranged from 25 to 91 W/m(exp 2)K for contact pressures of 0.172-0.862 MPa and mean junction temperatures of 20-100 C. Experimental thermal conductance values of vapor deposited silver- and gold-coated aluminum A356-T61 rail surfaces indicate thermal enhancements of 1.25-2.19 for the electroless nickel-plated copper junctions and 1.79-3.41 for the anodized aluminum junctions. The silver and gold coatings provide significant thermal enhancement; however, these coating-substrate combinations are susceptible to galvanic corrosion under some conditions. 25 refs.

• OSTI ID: 7244250
• Journal Information: Journal of Thermophysics and Heat Transfer; (United States), Vol. 8:2; ISSN 0887-8722
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
42 ENGINEERING
SEMICONDUCTOR DEVICES
SURFACE COATING
THERMAL CONDUCTIVITY
ELECTROCHEMICAL CORROSION
ALUMINIUM
COPPER
CHEMICAL REACTIONS
CORROSION
DEPOSITION
ELEMENTS
METALS
PHYSICAL PROPERTIES
THERMODYNAMIC PROPERTIES
TRANSITION ELEMENTS
360104* - Metals & Alloys- Physical Properties
426000 - Engineering- Components
Electron Devices & Circuits- (1990-)