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Title: Low coefficient of thermal expansion polyimides containing metal ion additives

Journal Article · · SAMPE Quarterly (Society of Aerospace Material and Process Engineers); (United States)
OSTI ID:7241801
;  [1]
  1. NASA Langley Research Center, Hampton, VA (United States)

Polyimides have become widely used as high performance polymers as a result of their excellent thermal stability and toughness. However, lowering their coefficient of thermal expansion (CTE) would increase their usefulness for aerospace and electronic applications where dimensional stability is a requirement. The CTE's of conventional polyimides range from 30 to 60 ppm/C. Approaches that have been reported to lower their CTE's include linearizing the polymer molecular structure and orienting the polyimide film. This current study involves the incorporation of metal ion-containing additives into polyimides and has resulted in significantly lowered CTE's. Various metal ion additives have been added to both polyamic acid resins and soluble polyimide solutions in the concentration range of 4-23 weight percent. The incorporation of these metal ions has resulted in reductions in the CTE's of the control polyimides of 12% to over 100% depending on the choice of additive and its concentration.

OSTI ID:
7241801
Journal Information:
SAMPE Quarterly (Society of Aerospace Material and Process Engineers); (United States), Vol. 23:4; ISSN 0036-0821
Country of Publication:
United States
Language:
English

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