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Title: Diorganosilacetylene-alt-diorganosilvinylene polymers and a process densifying porous silicon-carbide bodies

Patent ·
OSTI ID:7198435

The present invention provides linear organosilicon polymers including acetylene and vinylene moieties, and a process for their preparation. These diorganosilacetylene-alt-diorganosilvinylene linear polymers can be represented by the formula: --[--(R[sup 1])(R[sup 2])Si--C[triple bond]C-(R[sup 3])(R[sup 4])Si--CH[double bond]CH--][sub n]--, wherein n[>=]2; and each R[sup 1], R[sup 2], R[sup 3], and R[sup 4] is independently selected from the group consisting of hydrogen, halogen, alkyl, alkenyl, aryl, and aralkyl radicals. The polymers are soluble in organic solvents, air stable, and can be pulled into fibers or cast into films. They can be thermally converted into silicon carbide ceramic materials.

DOE Contract Number:
W-7405-ENG-82
Assignee:
Iowa State Univ. Research Foundation, Inc., Ames, IA (United States)
Patent Number(s):
US 5312649; A
Application Number:
PPN: US 8-073589
OSTI ID:
7198435
Resource Relation:
Patent File Date: 8 Jun 1993
Country of Publication:
United States
Language:
English