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Title: Selective protection of poly(tetra-fluoroethylene) from effects of chemical etching

Patent ·
OSTI ID:7181639

This patent describes a photolithographic method for treating an article formed of polymeric material comprises subjecting portions of a surface of the polymeric article to ionizing radiation; and then subjecting the surface to chemical etching. The ionizing radiation treatment according to the present invention minimizes the effect of the subsequent chemical etching treatment. Thus, selective protection from the effects of chemical etching can be easily provided. The present invention has particular applicability to articles formed of fluorocarbons, such as PTFE. The ionizing radiation employed in the method may comprise Mg(k[alpha]) X-rays or lower-energy electrons.

Assignee:
Dept. of Energy, Washington, DC (United States)
Patent Number(s):
US 5066565; A
Application Number:
PPN: US 7-330032; TRN: 92-037464
OSTI ID:
7181639
Resource Relation:
Patent File Date: 29 Mar 1991
Country of Publication:
United States
Language:
English