Enhancement of single-phase heat transfer and critical heat flux from an ultra-high-flux simulated microelectronic heat source to a rectangular impinging jet of dielectric liquid
- Purdue Univ., West Lafayette, IN (United States)
Jet impingement is encountered in numerous applications demanding high heating or cooling fluxes. Examples include annealing of metal sheets and cooling of turbine blades, x-ray medical devices, laser weapons, and fusion blankets. The attractive heat transfer attributes of jet impingement have also stimulated research efforts on cooling of high-heat-flux microelectronic devices. These devices are fast approaching heat fluxes in excess of 100 W/cm[sup 2], which have to be dissipated using coolants that are both electrically and chemically compatible with electronic components. Unfortunately, fluids satisfying these requirements tend to possess poor transport properties, creating a need for significant enhancement in the heat transfer coefficient by such means as increased coolant flow rate and phase change. The cooling problem is compounded by a need to cool large arrays of heat sources in minimal volume, and to reduce the spacing between adjacent circuit boards. These requirements place severe constraints on the packaging of jet impingement cooling hardware.
- OSTI ID:
- 7179446
- Journal Information:
- Journal of Heat Transfer (Transactions of the ASME (American Society of Mechanical Engineers), Series C); (United States), Vol. 114:3; ISSN 0022-1481
- Country of Publication:
- United States
- Language:
- English
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