Method of sputter etching a surface
Patent
·
OSTI ID:7157408
The surface of a target is textured by co-sputter etching the target surface with a seed material adjacent thereto, while the target surface is maintained at a pre-selected temperature. By pre-selecting the temperature of the surface while sputter etching, it is possible to predetermine the reflectance properties of the etched surface. The surface may be textured to absorb sunlight efficiently and have minimal emittance in the infrared region so as to be well-suited for use as a solar absorber for photothermal energy conversion. 4 figs.
- DOE Contract Number:
- AC06-76RL01830
- Assignee:
- Dept. of Energy, Washington, DC (United States)
- Patent Number(s):
- US 4431499; A
- Application Number:
- PPN: US 6-352738
- OSTI ID:
- 7157408
- Resource Relation:
- Patent File Date: 26 Feb 1982
- Country of Publication:
- United States
- Language:
- English
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