Metalization of lipid vesicles via electroless plating

Journal Article · Wed Jan 06 00:00:00 EST 1988 · J. Am. Chem. Soc.; (United States)

DOI:https://doi.org/10.1021/ja00209a046· OSTI ID:7148491

Ferrar, W T; O'Brien, D F; Warshawsky, A; Voycheck, C L

The encapsulation of metallic particles and metallic oxides within lipid vesicles has recently been of interest for applications such as catalysis, water splitting, and magnetic control of spin coupling. In this communication the authors introduce the concept and practice of the deposition of metal on vesicles by using electroless plating techniques. Coordination of low valent transition metals to organic functional groups on the surface of the bilayer membrane provides a means of binding metal atoms to vesicles. Chemical reduction produced zero valent atoms which serve as sites for further metal deposition by the chemical reduction techniques of electroless plating. Specifically, this procedure involved the binding of a small amount of tetrachloropalladate to the vesicle bilayer, reduction of the palladium(II) to palladium(0), followed by the deposition of much larger amounts of metal from an electroless plating solution. Electroless plating solutions were used for the deposition of palladium, nickel, cobalt, or copper metal onto the catalytic palladium centers. Since the metallic particles were associated with the vesicles, colloids were formed that were stable in water for much longer periods than the control metal particles formed in water alone. If the vesicles were composed in part of unsaturated lipids, with the olefinic groups on the hydrocarbon chains, the initial evidence suggests the transition metal was directed into the bilayer, rather than staying on the surface.

• Research Organization: Eastman Kodak Company, Rochester, NY (USA)
• OSTI ID: 7148491
• Journal Information: J. Am. Chem. Soc.; (United States), Vol. 110:1
• Country of Publication: United States
• Language: English

Related Subjects

37 INORGANIC
ORGANIC
PHYSICAL AND ANALYTICAL CHEMISTRY
08 HYDROGEN
COBALT
DEPOSITION
ELECTROPLATING
COPPER
LIPIDS
NICKEL
PALLADIUM
ELECTRON MICROSCOPY
EXPERIMENTAL DATA
DATA
ELECTRODEPOSITION
ELECTROLYSIS
ELEMENTS
INFORMATION
LYSIS
METALS
MICROSCOPY
NUMERICAL DATA
ORGANIC COMPOUNDS
PLATING
PLATINUM METALS
SURFACE COATING
TRANSITION ELEMENTS
400201* - Chemical & Physicochemical Properties
080101 - Hydrogen- Production- Electrolysis