Multi-lead heat sink
The disclosure relates to a heat sink used to protect integrated circuits from the heat resulting from soldering them to circuit boards. A tubular housing contains a slidable member which engages somewhat inwardly extending connecting rods, each of which is rotatably attached at one end to the bottom of the housing. The other end of each rod is fastened to an expandable coil spring loop. As the member is pushed downward in the housing, its bottom edge engages and forces outward the connecting rods, thereby expanding the spring so that it will fit over an integrated circuit. After the device is in place, the member is slid upward and the spring contracts about the leads of the integrated circuit. Soldering is now conducted and the spring absorbs excess heat therefrom to protect the integrated circuit. The placement steps are repeated in reverse order to remove the heat sink for use again. 4 figs.
- DOE Contract Number:
- W-7405-ENG-36
- Assignee:
- Univ. of California, Berkeley, CA (United States)
- Patent Number(s):
- US 4457360; A
- Application Number:
- PPN: US 6-411393
- OSTI ID:
- 7146595
- Resource Relation:
- Patent File Date: 25 Aug 1982
- Country of Publication:
- United States
- Language:
- English
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