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Title: Process for making metallized structure and article comprising structure

Patent ·
OSTI ID:7060543

This patent describes a process for making an article comprising a metallic material interface. It comprises: the step of electroplating the metal onto the material from an electroplating bath with conductivity grater than 10{sup {minus} 3} 1 mho-cm, the electroplating bath comprising nonaqueous solvent and source of metal to be electroplated. The metal capable of electrodeposition from a nonaqueous electroplating bath characterized in that the material is a superconducting oxide with superconducting transition temperature greater than 77 degrees Kelvin. Also described is an article comprising metal-material interface characterized in that the material is a superconducting oxide.

Assignee:
AT and T Bell Lab., Murray Hill, NJ
Patent Number(s):
US 4914081; A
Application Number:
PPN: US 7-144832A
OSTI ID:
7060543
Resource Relation:
Patent File Date: 15 Jan 1988
Country of Publication:
United States
Language:
English