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Title: ECM (Environmentally Conscious Manufacturing) newsletter, August 1990

Abstract

This newsletter outlines efforts to develop alternate cleaning solutions to conventional CFC and CHC based solvents for the cleaning of electrical and mechanical assemblies. Material compatibility is a primary concern. Testing results with copper substrates and Pb-Sn eutectic solder are presented. A novel sensor for monitoring the organic concentrations in copper plating baths is also described. Measurements are made in real time and the probe is small enough to be placed in the bath without disturbing the plating process. Longer intervals between bath cleanup and extended bath lifetimes will result.

Publication Date:
Research Org.:
Sandia National Labs., Albuquerque, NM (United States)
Sponsoring Org.:
USDOE; USDOE, Washington, DC (United States)
OSTI Identifier:
6977695
Report Number(s):
SAND-90-1375/1
ON: DE93009512
DOE Contract Number:  
AC04-76DP00789
Resource Type:
Technical Report
Country of Publication:
United States
Language:
English
Subject:
32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATION; 42 ENGINEERING; ELECTRONIC EQUIPMENT; CLEANING; SOLVENTS; MATERIAL SUBSTITUTION; COPPER; ELECTROPLATING; ENVIRONMENTAL IMPACTS; INDUSTRY; LEAD ALLOYS; MANUFACTURING; METALLURGICAL FLUX; MONITORS; SUBSTRATES; TIN ALLOYS; ALLOYS; DEPOSITION; ELECTRODEPOSITION; ELECTROLYSIS; ELEMENTS; EQUIPMENT; LYSIS; MEASURING INSTRUMENTS; METALS; PLATING; SURFACE COATING; TRANSITION ELEMENTS; 320305* - Energy Conservation, Consumption, & Utilization- Industrial & Agricultural Processes- Industrial Waste Management; 426000 - Engineering- Components, Electron Devices & Circuits- (1990-)

Citation Formats

. ECM (Environmentally Conscious Manufacturing) newsletter, August 1990. United States: N. p., 1990. Web.
. ECM (Environmentally Conscious Manufacturing) newsletter, August 1990. United States.
. 1990. "ECM (Environmentally Conscious Manufacturing) newsletter, August 1990". United States.
@article{osti_6977695,
title = {ECM (Environmentally Conscious Manufacturing) newsletter, August 1990},
author = {},
abstractNote = {This newsletter outlines efforts to develop alternate cleaning solutions to conventional CFC and CHC based solvents for the cleaning of electrical and mechanical assemblies. Material compatibility is a primary concern. Testing results with copper substrates and Pb-Sn eutectic solder are presented. A novel sensor for monitoring the organic concentrations in copper plating baths is also described. Measurements are made in real time and the probe is small enough to be placed in the bath without disturbing the plating process. Longer intervals between bath cleanup and extended bath lifetimes will result.},
doi = {},
url = {https://www.osti.gov/biblio/6977695}, journal = {},
number = ,
volume = ,
place = {United States},
year = {Wed Aug 01 00:00:00 EDT 1990},
month = {Wed Aug 01 00:00:00 EDT 1990}
}

Technical Report:
Other availability
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