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Title: Laser photochemical growth of amorphous silicon at low temperatures and comparison with thermal chemical vapor deposition

Conference ·
OSTI ID:6957182

Pulsed ArF (193 nm) excimer laser radiation has been used to dissociate disilane (Si/sub 2/H/sub 6/, resulting in photochemically controlled deposition of amorphous Si thin films. A high stability HeNe (6328 A) laser was used for precise in situ monitoring of film deposition rates, under varying deposition conditions. A helium window purge nearly eliminated Si film deposition on the chamber windows. With the excimer laser beam parallel to the substrate, deposition of amorphous Si can be controlled entirely by the photon fluence (negligible background thermal growth) at temperatures from room temperature up to /approximately/400/degree/C. Reasonable photolytic deposition rate (>1 A/sec) are combined with 'digital' control of film thickness (/approx gt/0.02 A/laser pulse). Activation energies of 1.50 (+-0.1) eV and 0.09 (+-0.02) eV were found for pyrolytic and photolytic deposition, respectively. 15 refs., 3 figs.

Research Organization:
Oak Ridge National Lab., TN (USA)
DOE Contract Number:
AC05-84OR21400
OSTI ID:
6957182
Report Number(s):
CONF-8711114-5; ON: DE88014547
Resource Relation:
Conference: Symposium on high temperature superconductors, Boston, MA, USA, 30 Nov 1987; Other Information: Portions of this document are illegible in microfiche products
Country of Publication:
United States
Language:
English