Effect of alumina composition on interfacial chemistry and strength of direct bonded copper-alumina

Conference · Sun Oct 01 00:00:00 EDT 1989 · Ceramic Engineering and Science Proceedings; (USA)

OSTI ID:6926423

Holowczak, J E; Greenhut, V A; Shanefield, D J

The gas-metal eutectic method was used to bond copper to sintered high alumina ceramics which had different sintering aid compositions in the magnesia-calcia-silica system. The highest average copper-alumina peel adhesion strength, 205 N/cm, was observed for alumina which contained 0.2 percent magnesia and 0.2 percent calcia. The lowest peel adhesion strength, 103 N/cm, was observed for copper bonded to 95 percent alumina which contained magnesia, calcia, and silica additions. This bond strength was similar to that for commercial 96 percent alumina. Statistical matrix experiments showed that alumina containing calcium silicate had significantly lower copper bond strength. This may be attributed to the formation of a transition compound other than the copper aluminate phase identified for well bonded samples in this study. 10 refs.

• OSTI ID: 6926423
• Report Number(s): CONF-890130-; CODEN: CESPD
• Journal Information: Ceramic Engineering and Science Proceedings; (USA), Vol. 10; Conference: 13. annual conference on composites and advanced ceramics, Cocoa Beach, FL (USA), 15-18 Jan 1989; ISSN 0196-6219
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
ALUMINIUM OXIDES
BONDING
COPPER ALLOYS
CALCIUM OXIDES
CERAMICS
COMPOSITE MATERIALS
FIBERS
INTERFACES
MAGNESIUM OXIDES
SINTERING
STABILITY
ALKALINE EARTH METAL COMPOUNDS
ALLOYS
ALUMINIUM COMPOUNDS
CALCIUM COMPOUNDS
CHALCOGENIDES
FABRICATION
JOINING
MAGNESIUM COMPOUNDS
MATERIALS
OXIDES
OXYGEN COMPOUNDS
360201* - Ceramics
Cermets
& Refractories- Preparation & Fabrication