Effects of simulated storage on the solder wettability of inhibited substrates

Conference · Wed Jan 01 00:00:00 EST 1992

OSTI ID:6921968

Hosking, F M; Sorensen, N R

Solder wettability of Class II environmentally exposed Cu substrates coated with an organic solderability preservative (OSP) is being investigated. The OSP coatings slightly retarded the wetting behavior of 60Sn-40Pb solder during baseline testing of unaged coupons. A nominal increase in wetting angle, or decrease in wettability, was observed on the inhibited surfaces, particularly when less active fluxes were used. Small increases in the wetting time and decreases in the wetting rate were also measured. Simulated accelerated aging tests are underway to determine the effects of aging in a typical indoor industrial environment on the solder wettability of OSP coated Cu.

• Research Organization: Sandia National Labs., Albuquerque, NM (United States)
• Sponsoring Organization: USDOE; USDOE, Washington, DC (United States)
• DOE Contract Number: AC04-76DP00789
• OSTI ID: 6921968
• Report Number(s): SAND-92-2434C; CONF-930242-1; ON: DE93004042
• Resource Relation: Conference: National Electronic Packaging in Production (NEPCON) west conference, Anaheim, CA (United States), 9 Feb 1993
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
COPPER
SOLDERING
WETTABILITY
METALLURGICAL FLUX
MICROELECTRONICS
PRESERVATIVES
SUBSTRATES
ELEMENTS
FABRICATION
JOINING
METALS
TRANSITION ELEMENTS
WELDING
426000* - Engineering- Components
Electron Devices & Circuits- (1990-)