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Title: Thin films

Conference ·
OSTI ID:6910185
; ;  [1];  [2]
  1. Stanford Univ., CA (USA)
  2. International Business Machines Corp., Yorktown Heights, NY (USA). Thomas J. Watson Research Center

This book contains the papers presented at a symposium entitled Thin Films: Stresses and Mechanical Properties, held at the 1988 Fall Meeting of the Materials Research Society. The idea for this symposium originated with the growing awareness of the importance of stresses and mechanical properties in thin film technologies and the recent introduction of new experimental techniques for studying stresses and mechanical properties in thin film media. It was organized to provide the first opportunity for materials scientists and engineers interested in these and related topics to discuss recent progress in the field. Both fundamental and applied problems were discussed, and individuals from a wide spectrum of university, industrial and government laboratories participated. Materials research is predicted on an interdisciplinary approach to problem solving. In that spirit, four major areas of interest were addressed at the symposium: Testing and Measurement Techniques, Heteroepitaxy, Fracture and Related Failure Mechanisms, and Thin Film Mechanical Properties. In each, both overview and material-specific papers were presented.

OSTI ID:
6910185
Report Number(s):
CONF-8811222-; CNN: AFOSR89-0142; ISBN: 1-55899-003-8
Resource Relation:
Conference: Thin films: stresses and mechanical properties, Boston, MA (USA), 28-30 Nov 1988; Related Information: Materials Research Society symposium proceedings. Volume 130
Country of Publication:
United States
Language:
English