Tensile creep in an in situ reinforced silicon nitride

Journal Article · Thu Sep 01 00:00:00 EDT 1994 · Journal of the American Ceramic Society; (United States)

DOI:https://doi.org/10.1111/j.1151-2916.1994.tb04612.x· OSTI ID:6888995

Gasdaska, C J ^[1]

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1. AlliedSignal, Inc., Morristown, NJ (United States). Corporate Research and Technology

The tensile creep of an in situ reinforced silicon nitride is described in terms of the rheological behavior of the thin intergranular film present in this liquid-phase sintered silicon nitride. The high stress exponents and apparent activation energies (at constant stress) can be explained assuming non-Newtonian flow behavior of the film during grain boundary sliding. Time-to-failure is related to the minimum creep rate, even for samples which fail by slow crack growth. In addition, the primary creep region and the relaxation effects observed on unloading are described in terms of grain boundary sliding modified by the presence of a grain boundary phase with a lower elastic modulus than silicon nitride.

• OSTI ID: 6888995
• Journal Information: Journal of the American Ceramic Society; (United States), Vol. 77:9; ISSN 0002-7820
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
SILICON NITRIDES
CREEP
EXPERIMENTAL DATA
MICROSTRUCTURE
TENSILE PROPERTIES
THIN FILMS
DATA
FILMS
INFORMATION
MECHANICAL PROPERTIES
NITRIDES
NITROGEN COMPOUNDS
NUMERICAL DATA
PNICTIDES
SILICON COMPOUNDS
360203* - Ceramics
Cermets
& Refractories- Mechanical Properties